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EDN
9 小时
Wide-creepage switcher improves vehicle safety
A wide-creepage package option for Power Integrations’ InnoSwitch 3-AQ IC enhances safety and reliability in automotive ...
EDN
9 小时
GPU IP powers scalable AI and cloud gaming
Vitality is VeriSilicon’s latest GPU IP architecture targeting AI PCs, cloud gaming, and both discrete and integrated ...
EDN
9 小时
R&S boosts GMSL testing for automotive systems
Rohde & Schwarz expands testing for automotive systems that employ Analog Devices’ Gigabit Multimedia Serial Link (GMSL) ...
EDN
1 天
Metamaterial’s mechanical maximization enhances vibration-energy harvesting
The number of ways to harvest energy that would otherwise go unused and wasted is extraordinary. To cite a few of the many ...
EDN
1 天
Gen3 UCIe IP elevates chiplet link speeds
Alphawave Semi’s Gen3 UCIe Die-to-Die (D2D) IP subsystem enables chiplet interconnect rates up to 64 Gbps. Building on the ...
EDN
1 天
UWB radar SoC enables 3D beamforming
Hydrogen, an ultra-wideband (UWB) radar SoC from Aria Sensing, delivers 3D MIMO beamforming with programmable pulse ...
EDN
1 天
Save, recall, and script oscilloscope settings
Reading and editing Visual Basic scripts or Standard Commands for Programmable Instruments (SCPI) to recall instrument ...
EDN
2 天
Perceiving the insides of a wireless camera flash receiver
After previously tearing down a transmitter, our intrepid engineer now tackles the other end of the wireless connection.
EDN
7 天
Innovative manufacturing processes herald a new era for flexible electronics
Electronics engineers are evaluating novel techniques for transfer printing, wiring, and additive manufacturing.
EDN
9 天
2025: A technology forecast for the year ahead
Elections, geopolitical tensions and AI…oh my! Read on for our intrepid engineer’s latest set of predictions (or, at minimum, ...
EDN
7 天
Touch controller eases user interface development
Microchip’s MTCH2120 turnkey touch controller offers 12 capacitive touch sensors configured via an I2C interface.
EDN
10 天
AI designs and the advent of XPUs
An XPU comprises four layers: compute, memory, network I/O, and reliable packaging technology. Industry watchers call XPU the ...
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